Application：

Purpose：

Keep the shape of the CMP plate or CMP Pad
Make the CMP pad change to rough surface that can carry more slurry particles
Clean the CMP pad and take out the particles from the pool of CMP pad
Keep and make the CMP pad longer lifetime

Product advantages：

Weight reduction around 50% compared to the competitors

Special patterned pellets processing technology

Pad surface before & after dressing

Particle carrying effect on Pad surface before & after dressing

Sinter Products：

Electroplate Products：

Specification：